Search for Author, Title, Keyword
The concept of integrating vapor chamber into a housing of electronic devices for increased thermal reliability
More details
Hide details
AGH University of Science and Technology Faculty of Electrical Engineering, Automatics, Computer Science and Biomedical Engineering Department of Automatic Control and Robotics
Publication date: 2020-06-30
Eksploatacja i Niezawodność – Maintenance and Reliability 2020;22(2):363–369
Systematic increase in computational power and continuous miniaturization of automotive electronic controllers pose a challenge to maintaining allowable temperature of semiconductor components, preventing premature wear-out or, in extreme cases, unacceptable shutdown of these devices. For these reasons, efficient and durable cooling systems are gaining importance in modern car technology design, showing critical influence on reliability of vehicle electronics. Vapor chambers (flat heat pipes) which could support heat management of automotive electronic controllers in the nearest future are passive devices, which transport heat through evaporation-condensation process of a working liquid. At present, vapor chambers are not commercially used in cooling systems of automotive controllers, being a subject of research and development endeavors aimed at understanding their influence on thermomechanical reliability of semiconductor devices used in cars. This paper presents a concept of an electronic controller aluminum housing integrated with a vapor chamber. The conceptual design was numerically validated in elevated temperature, typical for automotive ambient conditions. The paper discusses influence of the vapor chamber-based cooling system on the controller’s thermal performance, as well as on its reliability, expressed as the expected lifetime of the device.
Aranzabal I, de Alegría I M, Delmonte N, Cova P, Kortabarria I. Comparison of the Heat Transfer Capabilities of Conventional Single-and Two-Phase Cooling Systems for an Electric Vehicle IGBT Power Module. IEEE Transactions on Power Electronics 2018; 34(5): 4185-4194,
Cengel Y A. Heat transfer: a practical approach, 2nd Edition. McGraw-Hill Higher Education, 2002.
Chainer T J, Schultz M D, Parida P R, Gaynes M A. Improving data center energy efficiency with advanced thermal management. IEEE Transactions on Components, Packaging and Manufacturing Technology 2017; 7(8): 1228-1239,
Chang N, Pan S, Srinivasan K, Feng Z, Xia W, Pawlak T, Geb D. Emerging ADAS Thermal Reliability Needs and Solutions. IEEE Micro 2018; 38(1): 66-81,
Gadalla B, Schaltz E, Blaabjerg F. A survey on the reliability of power electronics in electro-mobility applications. Proceedings of: 2015 Intl Aegean Conference on Electrical Machines & Power Electronics (ACEMP), 2015 Intl Conference on Optimization of Electrical & Electronic Equipment (OPTIM) & 2015 Intl Symposium on Advanced Electromechanical Motion Systems (ELECTROMOTION) 2015; 304-310,
Gu J, Pecht M. Predicting the reliability of electronic products. Proceedings of: 8th International Conference on Electronic Packaging Technology 2007; 1-8,
Gurevich A, Steiner I, Huang E. Design of thermal systems based on combination of Thermoelectric and Vapor Chamber technologies. Proceedings of: 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) 2017; 1-5,
Hager M, Gromala P, Wunderle B, Rzepka S. Affordable and Safe High Performance Vehicle Computers with Ultra-Fast On-Board Ethernet for Automated Driving. Advanced Microsystems for Automotive Applications 2018: Smart Systems for Clean, Safe and Shared Vehicles.Springer, 2019,
Hammoud J, Dudley S, Apte N. Use of Heat Pipe Technology for Multi Media Thermal Management. Proceedings of: SAE 2006 World Congress & Exhibition 2006; 1-3,
Khazaka R, Mendizabal L, Henry D, Hanna R. Survey of high-temperature reliability of power electronics packaging components. IEEE Transactions on power Electronics 2014; 30(5): 2456-2464,
Ma X, Guo Y, Wang L, Ji W. Exploration of the reliability of automotive electronic power steering system using device junction electrothermal profile cycle. IEEE Access 2016; 4: 7054-7062,
Mochizuki M. Latest development and application of heat pipes for electronics and automotive. Proceedings of: IEEE CPMT Symposium Japan 2017; 87-90,
Niittymaki L, Biber C, Carbone M. Flexible CFD simulation model of a thin vapor chamber for mobile applications. Proceedings of: 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) 2016; 152-157,
Qi F, Wang Y, Bob-Manuel C, Li H, Jones S, Li B, Chen Y, Yan Y. Advanced Cooling Solutions of High Power Automotive Module. Proceedings of: PCIM Asia 2017: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management 2017; 1-3.
Ram Sundar R, Sarweshwara Sarma N S V. Performance study of motorcycle driving-beam LED headlight with different heat sink models and LED pitch. Proceedings of: 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2017; 784-792.
Riches S, Johnston C. Electronics design, assembly and reliability for high temperature applications. Proceedings of: IEEE International Symposium on Circuits and Systems (ISCAS) 2015; 1158-1161,
Robinson A J, Colenbrander J, Kempers R, Chen R. Solid and Vapor Chamber Integrated Heat Spreaders: Which to Choose and Why.IEEE Transactions on Components, Packaging and Manufacturing Technology 2018; 8(9): 1581-1592,
Simon D, Boianceanu C, De Mey G, Ţopa V. Experimental reliability improvement of power devices operated under fast thermal cycling. IEEE Electron Device Letters 2015; 36(7): 696-698,
Sun L, Gu X H, Song P, Di Y. A generalized equivalent temperature model in a time-varying environment. Eksploatacja i Niezawodnosc - Maintenance and Reliability 2017; 19(3): 432-440,
Tan C M, Narula U, Kapoor D. Reliability paradox for worldwide automotive electronics. Proceedings of: IEEE Annual Reliability and Maintainability Symposium (RAMS) 2017; 1-7,
Webber A. Calculating Useful Lifetimes of Embedded Processors: Application Report. Texas Instruments Incorporated, 2017.
Zeng S, Sun B, Tong C. A modified model of electronic device reliability prediction. Eksploatacja i Niezawodnosc - Maintenance and Reliability 2009; 4(44): 4-9.
Reliability of Automotive Multidomain Controllers: Advancements in electronics cooling technologies
Jakub Korta, Pawel Skruch, Krzysztof Holon
IEEE Vehicular Technology Magazine