RESEARCH PAPER
Strength analysis of solder joints used in microelectronics packaging
1
Wroclaw University of Science and Technology Faculty of Microsystem Electronics and Photonics ul. Janiszewskiego 11/17, 50-372 Wrocław, Poland
Publication date: 2020-06-30
Eksploatacja i Niezawodność – Maintenance and Reliability 2020;22(2):297-305
KEYWORDS
ABSTRACT
The aim of the research was the problem of damage accumulation for solder alloys used in microelectronics packaging due to
creep and fatigue as a result of a combined profile of loading conditions. The selected failure modes affect the lifetime of contemporary electronic equipment. So far the research activities are focused on a single failure mode and the problem of their interaction is
often omitted. Taking into account the failure modes interaction would allow more precise lifetime prediction of the contemporary
electronic equipment and/or would allow for reduction of time required for reliability tests. Within the taken research framework
the reliability analysis of solder joints was conducted for the Sn63Pb37 solder alloy using the Hot Bump Pull method. The results
of the presented research contain: reliability tests, statistical analysis and the problem of a damage accumulation due to a combined profile of loading conditions.
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Influence of induction heating of injection molds on reliability of electrical connectors
Krzysztof Mrozek, Paweł Muszyński, Przemysław Poszwa
Eksploatacja i Niezawodność – Maintenance and Reliability
Krzysztof Mrozek, Paweł Muszyński, Przemysław Poszwa
Eksploatacja i Niezawodność – Maintenance and Reliability
| eISSN: | 2956-3860 |
| ISSN: | 1507-2711 |
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